In SAN LUIS OBISPO, California on January 15, 2024, a strategic collaboration has been announced between Revasum Inc, one of the world's leading semiconductor manufacturing equipment suppliers, and Asahi Diamond America, Inc., one of the world's leading suppliers of diamond and cubic boron nitride tools, in order to enhance the grinding of silicon carbide wafers (SiC).
The source of this information is Revasum
It is with great enthusiasm that Revasum, Inc., a leading supplier of semiconductor manufacturing equipment, is pleased to announce the establishment of a strategic partnership with...
It is with great pleasure that Revasum, Inc, the world's leading provider of cutting-edge equipment for the manufacture of semiconductor devices, announces its strategic partnership with...

Source prnewswire