For the eleventh time running, Synopsys, Inc. (Nasdaq: SNPS) has been chosen as a TSMC Open Innovation Platform® (OIP) Partner of the Year, garnering six honours in the 2023 competition. The two firms’ long-standing cooperation has been successful in advancing development in important technological fields such high-quality interface IP, RF design, cloud-based productivity, and multi-die systems.

According to Dan Kochpatcharin, Head of Design Infrastructure Management Division at TSMC, “Recognizing Synopsys with six 2022 TSMC OIP Partner of the Year awards underscores our appreciation for the deep impact our partnership continues to make on advanced semiconductor design.” “Together, we are enabling the future of computing in ground-breaking fields like multi-die design. Beyond that, we’re developing new and captivating approaches to realise the next generation of high-performance computing, automotive, mobile, 5G, and AI architectures.”

The collaboration between the companies over the previous year has produced outstanding results in areas like:

for TSMC’s 16nm FinFET Compact (16FFC) technology, Synopsys, Ansys, and Keysight Technologies have created a new mmWave RF design procedure. Using cutting-edge, market-leading tools for RFIC design, designers can take advantage of the open, front-to-back design flow that offers performance, power, and productivity benefits.
When switching from TSMC’s N5 and N4 to the new N3E technology, the Synopsys Custom Design Family offers an analogue migration path for effective reuse of analogue and IP designs. Using template-based placement and routing techniques, the flow facilitates the optimization of analogue circuits and layout regeneration on the target technology.

Source: Prnewswire