Texas Instruments (TI) (Nasdaq: TXN) today announced an expansion of its line of analogue semiconductor components for use in space that are housed in highly dependable plastic packages for a variety of missions. For radiation-hardened electronics, TI created a new device screening specification called space high-grade in plastic (SHP) and released new analog-to-digital converters (ADCs) that satisfy the SHP qualification. The portfolio of radiation-resistant Space Enhanced Plastic (Space EP) product families was expanded by TI. Plastic packages have a smaller footprint than conventional ceramic packaging, which allows designers to minimise system-level size, weight, and power and, as a result, lower launch costs.

Ceramic Qualified Manufacturers List (QML) Class V devices with hermetically sealed construction have previously been utilised in space applications and projects to ensure reliability. Currently, short-duration missions in low Earth orbit (LEO) are increasing commercial access to space programmes and assisting in the expansion of communication and connection. Smaller components are increasingly needed for new space applications because they can assist reduce system size and weight, which lowers the cost of launching an application into space. Devices with plastic encapsulation and plastic substrate ball-grid array (PBGA) are an alternative to conventional space semiconductor packaging.

Source: Prnewswire