On April 17–20, 2023, in the Ambassador Hotel Hsinchu, Taiwan, the Industrial Technology Research Institute (ITRI) will organise the 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA). TSMC, Intel, NVIDIA, Massachusetts Institute of Technology, UC Santa Barbara, the University of Tokyo, Cadence Design Systems, Inc., University of California, Los Angeles, CEA-Leti, and Siemens EDA experts will share their knowledge and the most recent research findings on hot topics like quantum computing, heterogeneous integration, energy-efficient VLSI technologies, sensors, and applications for automotive and dro.
Since its founding in 1983, VLSI TSA has been the leading conference on VLSI in semiconductor-related subjects, drawing up to 1,000 attendees annually. Six renowned professionals will deliver exceptional keynote addresses at the event in 2023. Professor John Martinis of the University of California, Santa Barbara, will discuss the state of quantum computing technologies. Mr. Robert Munoz of Intel will explain how and why chiplet-related industry collaboration activities are essential to more thorough reuse at an industrial scale, fundamentally changing how our industry collaborates to develop future systems. The University of Tokyo’s Prof. Ken Takeuchi will provide an example of how Computation-in-Memory may create an energy-efficient neuromorphic system, particularly at the edge AI. Professor Shih-Lien Lu of Warner Pacific University will focus on several facets of hardware security as she examines the opportunities and difficulties of security from the perspective of VLSI design and technology. Dr. Olivier Faynot, the head of CEA-Silicon Leti’s Component Department, will talk about recent advancements that will affect how much power is used for data generation, transfer, computation, and storage. At the 2023 VLSI TSA, Dr. Y.-C. Frank Wang of NVIDA will also participate in the keynote presentation with the most recent research discoveries.

Source: Prnewswire